J Eur Ceram Soc 28(5):1105–1109, Mahanta NK, Loos MR, Zlocozower IM, Abramson AR (2015) Graphite–graphene hybrid filler system for high thermal conductivity of epoxy composites. 12a. SN Appl. Also, the presence of these hybrid particles (mh-BN and RGO) results in surface roughness, which is in good agreement with AFM images in Fig. 3. 12a) demonstrates that there is good interfacial interaction between hybrid filler and epoxy matrix, which may be the source of good thermal and consistent mechanical properties. To get more modified h-BN (mh-BN), the above process was followed as per discussed proportionate. Ltd. 3-amino propyl triethoxysilane (APTES) was obtained from HIMEDIA Laboratories, Mumbai, India. Single-layer graphene exhibits high TC (5300 W/mK), and comparable thermal interface resistance of graphene is ~ 3.7 × 10−9 m2K/W which is marginally lower than CNT (8 × 10−8m2K/W) [5]. 0000005094 00000 n where KC is the TC of the composite. Then, curing agent was added followed by 5 min sonication. J Inorg Organomet Polym Mater 16(2):175–183, MathSciNet  This is because of the formation of long-range 3D conducting networks for phonon transfers inside the filler–matrix system and effect of h-BN on TC of hybrid composites, as the synergistic effect of h-BN with GO and RGO was quite appreciable. However, we have ignored different effective parameters such as TC ratios of fillers, size of filler and void, for these models to calculate the values. As per Yuan et al. It was found that the thermal conductivity of pristine epoxy (0.21 W/mK) enhanced gradually with the incorporation of GO or RGO with h-BN and mh-BN. Use them to fill gaps and rebuild missing material on electrical connections or to assemble new components.. 0000006153 00000 n Figure 3b shows the SEM images of GO and RGO. Out of different surface preparation methods, mechanical polishing was adopted for creating strong and durable adhesive–substrate bond strength. The flexural strength and impact strength of neat epoxy are 131 MPa and 13 kJ/m2, respectively. Chen et al. 0000009357 00000 n The thermal decomposition temperature for neat epoxy is 355.73 °C, whereas hybrid composites known as (1) h-BN/GO4/epoxy, (2) h-BN/RGO4/epoxy, (3) mh-BN/GO4/epoxy, (4) mh-BN/RGO4/epoxy are showing the thermal decomposition temperature of 376.71, 378.84, 372.82 and 374.53 °C, respectively. It was found that the thermal conductivity of pristine epoxy (0.21 W/mK) enhanced gradually with the incorporation of GO or RGO with h-BN and mh-BN. [1] prepared electrical insulating epoxy composite using silane-treated BN nanoplatelets with a maximum TC of 5.24 W/mK. The sample containing 44.5 wt% (40 wt% mh-BN and 4.5 wt% RGO) hybrid filler exhibited the highest thermal conductivity (1.416 W/mK) which was 7 times that of pristine epoxy (0.21 W/mK). Carbon Lett 15(1):67–70, Tang LC, Wan YJ, Yan D, Pei YB, Zhao L, Li YB, Lai GQ (2013) The effect of graphene dispersion on the mechanical properties of graphene/epoxy composites. In this work, h-BN and APTES-modified h-BN were incorporated in an epoxy matrix along with GO and RGO with different weight fractions [14]. PubMed Google Scholar. But the ‘d’ of GO increased to 0.854 nm due to the introduction of oxygen-containing functional groups at the time of oxidation. 5b, GO sample shows a broad and outstanding absorption peak at 3534 cm−1, which can be attributed to the stretching vibration of –OH group. The TC of hybrid composites increases at the loading of mh-BN instead of h-BN with GO and RGO as defined earlier. The term f represents the volume fraction of filler. Figure 10 shows the plots of flexural (Fig. It was also cited that due to the iso-structure of h-BN and RGO, the compatibility between two hybrid particles enhances [18, 19]. 1. Carbon 126:119–127, Muthu RN, Rajashabala S, Kannan R (2016) Facile synthesis and characterization of a reduced graphene oxide/halloysite nanotubes/hexagonal boron nitride (RGO/HNT/h-BN) hybrid nanocomposite and its potential application in hydrogen storage. Flexural strength (a) and impact strength (b) of different optimized hybrid composites. Appl Phys Lett 107(5):051104, Aradhana R, Mohanty S, Nayak SK (2018) Comparison of mechanical, electrical and thermal properties in graphene oxide and reduced graphene oxide filled epoxy nanocomposite adhesives. Then, fillers were added and followed by hand stirring. prepared heat conducting bridge between GO and a ceramic particle such as AlN as a hybrid filler to incorporate inside the epoxy matrix. The presence of both cohesive and interfacial failures on the joint area of lap predicts the propagation of cracks through the bulk of composites and then shifts to an interface which required more energy to create failure [24, 26]. In Fig. All the optimized hybrid composites carry the filler loading of 44.5 wt% (40 wt% h-BN/mh-BN + 4.5 wt% GO/RGO). The uniform layer of bond line thickness (BLT) about 0.05–0.1 mm was prepared to make lap joints. Thermal conductivity of a typical unfilled epoxy system has a very low value of 0.14 W/(m•K). The maximum value of thermal conductivity is 1.416 W/mK which is obtained due to the addition of RGO (4.5 wt%) and mh-BN (40 wt%) hybrid in an epoxy matrix. Mater Res Bull 97:19–23, Baruch AE, Bielenki L, Regev O (2012) Thermal conductivity improvement of electrically nonconducting composite materials. Nanoscale Res Lett 9(1):643, Article  From particle size analyzer, it is clear that as shown in Fig. So, the reaction between epoxy composites as adhesive and substrate is improved due to electron sharing with the oxygen present in epoxide dimer and trimer, for which high joint strength is formed between substrate and epoxy composites as adhesives. This key property can be increased by adding metallic or ceramic fillers to the adhesive formulation. Thermal conductivity measurements In-plane and transverse thermal conductivity … FTIR spectra of h-BN and mh-BN (a) and GO and RGO (b). Flow diagram for surface modification of h-BN. Rev Chem Eng 28(1):61–71, Hansson J, Nilsson TM, Ye L, Liu J (2018) Novel nanostructured thermal interface materials: a review. As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and RGO are incorporated. H-BN displays two strong attributes in-plane B–N extending vibration at 1393.61 cm−1 and out-plane twisting vibration at 789.76 cm−1. trailer << /Size 1048 /Info 1006 0 R /Root 1010 0 R /Prev 246936 /ID[<269b941955d53c191626509df344c992><128657cd8b7c76e5d676c88a56d531a9>] >> startxref 0 %%EOF 1010 0 obj << /Type /Catalog /Pages 1007 0 R /Metadata 1008 0 R /Outlines 50 0 R /OpenAction [ 1012 0 R /XYZ null null null ] /PageMode /UseNone /PageLabels 1005 0 R /StructTreeRoot 1011 0 R /PieceInfo << /MarkedPDF << /LastModified (D:20030918090347)>> >> /LastModified (D:20030918090347) /MarkInfo << /Marked true /LetterspaceFlags 0 >> >> endobj 1011 0 obj << /Type /StructTreeRoot /ClassMap 54 0 R /RoleMap 56 0 R /K 568 0 R /ParentTree 957 0 R /ParentTreeNextKey 15 >> endobj 1046 0 obj << /S 248 /O 408 /L 424 /C 440 /Filter /FlateDecode /Length 1047 0 R >> stream J Mater Res 30(7):959–966, An F, Li X, Min P, Li H, Dai Z, Yu ZZ (2018) Highly anisotropic graphene/boron nitride hybrid aerogels with long-range ordered architecture and moderate density for highly thermally conductive composites. Use them to encase electronic … ASTM Method E1952 (1) describes the measurement of thermal conductivity by Modulated DSC . J Am Ceram Soc 95(1):369–373, Gong Y, Li D, Fu Q, Pan C (2015) Influence of graphene microstructures on electrochemical performance for supercapacitors. They demonstrated the TC value at this loading was 1.6 W/mK [37]. However, epoxy resins have a poor thermal conductivity (0.15–0.25 W/mK [7,8]). This is due to the better distribution of mh-BN as compared to pristine h-BN. GO has been synthesized by modified Hummer’s method [6,7,8]. But RGO cannot transfer its mechanical strength as aromatic rings restore. The absence of a 3534 cm−1 peak in RGO reveals the absence of OH group after reduction. In recent years, significant interest has been focused on fabricating epoxy-based hybrid composite with a high thermal conductivity at optimum filler loading. After proper mixing of h-BN and mh-BN in an epoxy matrix, previously defined amount of GO and RGO was added followed by 3 h sonication to make hybrid composites as explained in Table 1. 4a. Appl Therm Eng 106:1067–1074, Wang Z, Qi R, Wang J, Qi S (2015) Thermal conductivity improvement of epoxy composite filled with expanded graphite. These above results indicate that the elimination of partial functional groups in GO is done effectively by reduction [13, 23]. %PDF-1.3 %���� 4 can be assumed as terms in Eq. However, high loading, i.e., more than 60% filler fraction, pays penalty to mechanical and other properties like viscosity and bonding strength, which create hindrance in the application of high-performance electrical chip [16]. 0000004421 00000 n 0000073213 00000 n Φ represents the volume fraction of the dispersed phase. The long-MWCNT composites exhibited higher thermal conductivity than the short-MWCNT composites when the weight percentages were the same. As per Sreekanth Perumbilavil et al., XRD diffraction peak for pristine graphite is at 2θ = 26.36° with interlayer spacing (d) of 0.335 nm, whereas GO diffraction peak is at 2θ = 10.01°. But at 4.5 wt% of both GO and RGO loadings, the TC slightly decreases to 0.293 and 0.311 W/mK, respectively. The agglomeration of unmodified h-BN with RGO is evidently visible in Fig. Then, h-BN/epoxy and mh-BN/epoxy composites were fabricated with 10, 20, 30 and 40 wt% of filler loading separately. 0000003768 00000 n 0000006796 00000 n information16,17, the longitudinal thermal conductivity of the fibers at 300 K is reported in Tab. In order to enhance the thermal conductivity, thermally conductive but electrically insulative materials should be introduced to … DLS technique shows that the particle size of h-BN is 2.12 µm which is defined by the manufacturer. The thermal conductivities of RGO with unmodified h-BN (0.789 W/mK), GO with mh-BN (0.769 W/mK) and GO with unmodified h-BN (0.713) at 44.5 wt% loading are also reported. 0000083418 00000 n [13] demonstrated that at 26.04 vol% of h-BN loading the composite showed TC value approximately 0.8 W/mK. system used, cured epoxy can have a resulting bulk thermal conductivity measured anywhere from 0.5 W/mK to upwards of 35 W/mK. Graphene and boron nitride possess thermal conductivity of 5300 and 300 W/m‧K, respectively. © 2020 Springer Nature Switzerland AG. THERMOLOX 701A – This thermally conductive epoxy has a simple 1:1 epoxy ratio and is filled with a blend of Aluminum Nitride giving it a centipoise of 40,000 coating. 0000008793 00000 n XRD patterns of h-BN and mh-BN are illustrated in Fig. - 23.118.218.37. 13a, b. The peak at 1392 cm−1 represents =C–H vibration in GO. The type of filler, concentration of particles, their size and shape will determine the thermal conductivity of the product. Comparing the experimental TC values with calculated analytical values, it is observed that the series model estimates the lower value of TC in relation to the experimental value. This creates an impact on the surface area and wettability of reinforcement [30, 31]. The hybrid composites of different compositions were applied on mechanically polished steel substrates by carefully rubbing with 400-grade emery paper and cleaning with acetone. 3a indicates the few-layer structure with less interplanar spacing between monolayers [35]. Laser diffraction particle size analyzer (LA-960, Horiba Scientific) was used to measure the size distribution profile or particle size of h-BN and GO water suspension in dynamic light scattering (DLS) technique. 1009 0 obj << /Linearized 1 /O 1012 /H [ 1636 509 ] /L 267248 /E 87797 /N 7 /T 246948 >> endobj xref 1009 39 0000000016 00000 n Fig. Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds. Epoxy is well known for its excellent mechanical properties and thermal stability, best adhesion and good electrical insulation properties and compatibility with many materials [2, 3]. Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application, $$Q = - KA\left[ {\frac{{\Delta T}}{{\Delta x}}} \right]$$, $${\text{Maxwell}}\;{\text{equation}}:\frac{K}{{K_{\text{c}} }} = 1 + 3\left( {\frac{{K_{\text{d }} - K_{\text{c}} }}{{K_{\text{d}} + 2K_{\text{c}} }}} \right)\varPhi$$, $${\text{Hashin - Shtrikman}}\;{\text{model:}}\;K_{\text{C}} = K_{\text{m}} \left[ {\frac{{2\left( {1 - f} \right)K_{\text{m}} + \left( {1 + 2f} \right)K_{\text{f}} }}{{\left( {2 + f} \right)K_{\text{m}} + \left( {1 - f} \right)K_{\text{f}} }}} \right]$$, $${\text{Inverse}}\;{\text{rule}}\;{\text{of}}\;{\text{mixture/series}}\;{\text{model:}}\;\frac{1}{{K_{\text{C}} }} = \frac{1 - f}{{K_{\text{m}} }} + \frac{f}{{K_{\text{f}} }}$$, https://doi.org/10.1007/s42452-019-0346-2. The red arrows represent the void developed at the time of fabrication of composite as the result of improper dispersion of hybrid filler with the matrix as the consequence of gas bubble, defects and stress concentration point are introduced. The h-BN powders (255475-50G) with dimension ~ 2 µm were obtained from Sigma-Aldrich Co., Germany. At 40 wt% loading of h-BN and mh-BN with epoxy, the TC values were observed at 0.53 and 0.59 W/mK, respectively. The fabricated hybrid composites exhibit outstanding performance in lap shear strength, thermal stability, and slightly reduced impact and flexural strength, which makes it as relevant for electronics packaging application such semiconductors, integrated circuit packaging, optoelectronics and also can attest potentiality in structural energy storage application. We declare that this work is completely original, and research was conducted of in a sound mind considering or following different articles previously published. The GO exhibits a sharp diffraction peak (001) at a diffraction angle 2θ = 11.5° while in reduced GO, (001) peak disappears and a new peak (002) was observed at 2θ = 26.3°. Sci Rep 6:36143, Park W, Guo Y, Li X, Hu J, Liu L, Ruan X, Chen YP (2015) High-performance thermal interface material based on few-layer graphene composite. Butane - Thermal Conductivity - Online calculators, figures and tables showing thermal conductivity of liquid and gaseous butane, C 4 H 10, at varying temperarure and pressure, SI and Imperial units … A pre-mixed, degassed, tested and frozen epoxy… As compared to sample manifest as h-BN/GO4/epoxy hybrid composite, containing the same amount of filler as sample h-BN/RGO4/epoxy hybrid composite, the only difference is GO, RGO and having less thermal decomposition temperature, i.e., 376.71 °C. The thermal conductivity (K, W/mK) at 60 °C is measured on the circular sample in accordance with ASTME 1530-06 standard by guarded heat flow meter technique (Unitherm™2022, Antercorpo, USA), which follows Eq. A high silver content allows these surface fillers to conduct electricity and heat. Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Good thermal conductivity (0.72 W/m-K) Low CL ion content and outgassing; 3M™ Thermally Conductive Epoxy Adhesive TC-2707 is a thermally conductive 2-part epoxy using aluminum metal fillers for good thermal conductivity … So, the recovery sp2 type structure establishes more π–π interactions for which restacking of RGO layers occurs. Wenhui Yuan et al. The epoxy is diglycidyl ether of bisphenol-A (DGEBA), named as Araldite GY 250, and the corresponding crosslinker is tri-ethylene tetra amine (TETA), named as Aradur®HY 951 IN, supplied by M/S Huntsman international (INDIA) Pvt. The TGA curve of neat epoxy and the four optimized hybrid composites is illustrated in Fig. 0000072925 00000 n Huang et al. 7, it is proved that TC is increasing with the increase in filler addition and also the effect of hybrid filler contributes to the TC enhancement [40, 41]. The material is ideal for applications requiring a self-leveling room temperature cure and better than average thermal conductivity. The device developed here can measure thermal conductivity of epoxy resin with accuracy up to 3%. where K is the TC of the composite. Arch Appl Mech 77(7):453–460. 0000045399 00000 n The fabrication of thermal interface material (TIM) based on epoxy adhesive incorporating hybrid filler of GO and RGO with h-BN is purposefully done. Equation 4 is derived from the rule of the mixture and does not consider voids. The h-BN/GO and h-BN/RGO–epoxy hybrid composites were fabricated using hand lay-off technique which is summarized in Table 1. 0000072716 00000 n The composites titled as mh-BN/GO4/epoxy and mh-BN/RGO4/epoxy represent the optimized hybrid filler loading of GO and RGO with modified h-BN. Compos Sci Technol 110:152–158, Fujihara T, Cho HB, Nakayama T, Suzuki T, Jiang W, Suematsu H, Niihara K (2012) Field-induced orientation of hexagonal boron nitride nanosheets using microscopic mold for thermal interface materials. THERMALCONDUCTIVITYOFGLASS1 FIBER/EPOXYCOMPOSITESUPPORT BANDSFORCRYOGENICDEWARS, PHASE II NationalBureauofStandards U.S.DepartmentofCommerce Boulder,Colorado80303 March1984 \pO Wyb vnA. The TGA analysis was carried out by taking the sample in the pan (5–10 mg), and the temperature was increased by 10 °C/min over a temperature range 30–800 °C under nitrogen purging with a flow rate of 60 ml/min. 0000003536 00000 n In Fig. SN Applied Sciences Carbon 59:406–417, Yu Z, Wang X, Bian H, Jiao L, Wu W, Dai H (2018) Enhancement of the heat conduction performance of boron nitride/cellulosic fibre insulating composites. 10a, b, it is also observed that matrix carrying GO with h-BN and GO with mh-BN has little higher properties than corresponding RGO with h-BN and RGO with mh-BN. The chart belo… 12a. 1, 337 (2019). 7 along with previously gathered experimental values [39,40,41]. The extra bands at 1209 cm−1 represent C=O=C stretching vibration absorption [8, 10]. In: IOP conference series: materials science and engineering, vol 274, no. The stretching vibration of C=O from carbonyl and carboxylic is found at 1744 cm−1 and C=C vibration of unoxidized graphite peak at 1627.5 cm−1. 0000001135 00000 n 0000003493 00000 n 1 and the thermal conductivity k r of the epoxy resin is 0.1 W.m-1.K-1 at 80 K and it is 0.25 W.m-1.K-1 at 0.25300 K. II. The required quantities of fillers were dried in a vacuum oven for 2 h at 60 °C. 0000002599 00000 n Sci. The filler includes metal particle such as Cu, Al and Ag, carbon-based filler like graphite plates, CNTs, graphene sheets which are also electrically conductive and ceramic particles like hexagonal boron nitride (h-BN), silicon carbide (SiC), beryllium oxide (BeO), aluminum nitride (AlN), alumina (Al2O3), which have electrical insulating properties [11]. 0000007465 00000 n Ltd. (Bangalore, India). The analytical results of composite related to GO are shown in Table 2 and shown in Fig. [38] also reported that the modified h-BN with graphene nanosheets with a mass ratio of 6:4 (total 10 wt%) with epoxy give raises the TC value of 0.48 W/mK. product allows for both high electrical conductivity and superior thermal conductivity. Int Mater Rev 63(1):22–45, Huang L, Zhu P, Li G, Lu DD, Sun R, Wong C (2014) Core–shell SiO 2@ RGO hybrids for epoxy composites with low percolation threshold and enhanced thermo-mechanical properties. c Thermal conductivity of h-BN/GO and h-BN/RGO–epoxy hybrid composites with different filler fractions. Thermal conductivity of 0.68 W/(m•K) Low exotherm Convenient 1A:1B volume mix ratio High compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals, … where Q is the heat supplied (Joules/s or Watts); K is the thermal conductivity of composite (W/mK); A is the area of the sample (m2); ∆x is the thickness of the sample (m). Ceram Int 41(10):13541–13546, Huang T, Zeng X, Yao Y, Sun R, Meng F, Xu J, Wong C (2016) Boron nitride@ graphene oxide hybrids for epoxy composites with enhanced thermal conductivity. 13c, d. SEM images of h-BN/RGO4/epoxy (a, b), mh-BN/RGO4/epoxy (c, d). The low-temperature epoxy resins and corresponding hardener were mixed in a ratio of 10:1 with hybrid particles. Article  u��9��#\�rzԬW�w9J�ruܩ��2%�ɪ�.����:ʢpL���wyLմ�iNlv��"���jq�����᷁�+u �6vIK� �& �((��T� ��(@s>PF��qg�h���j��3U2\�]dr�*bYF%��L9@�U@��0c��͚ǰ���a'W�L4�]�v�v�E����(�1�t}ϰMk�^�?�Ձ���q'�Cw2h ����Z �����yw.��&L���;5��|��. [36] explained that the improvement in TC values up to the certain extent of GO and RGO filler loading and TC value decreases due to agglomeration of filler. a XRD patterns of h-BN and modified h-BN (mh-BN), b SEM images of mh-BN (i) and h-BN (ii). We are giving our consent for any further clarification. Also, the thermal stability of all the four optimized hybrid composites performed well up to 250 °C. PLoS ONE 13(7):e0200842, Yaragalla S, Rajendran R, Jose J, AlMaadeed MA, Kalarikkal N, Thomas S (2016) Preparation and characterization of green graphene using grape seed extract for bioapplications. Therefore, the interfacial phonon scattering and thermal resistance inside the epoxy are reduced efficiently. J Mater Sci Mater Electron 29(19):16932–16938, Cui X, Ding P, Zhuang N, Shi L, Song N, Tang S (2015) Thermal conductive and mechanical properties of polymeric composites based on solution-exfoliated boron nitride and graphene nanosheets: a morphology-promoted synergistic effect. 0000008145 00000 n The atomic force microscopy and scanning electron microscopy verified the surface roughness and morphology of two optimized compositions, i.e., mh-BN with RGO and h-BN with RGO with the epoxy matrix. The effect of modified h-BN (mh-BN) on the thermal conductivity of the hybrid composites system is shown in Fig. On average, standard filled epoxy adhesives achieve thermal conductivity measurements of between 0.4 and 0.55 W/m.K , whereas an unfilled epoxy adhesive would achieve less (which is a pity as many … 6d. Gu et al. Angew Chem Int Ed Engl 40(11):2004–2021, Ghosh PK, Halder S, Goyat MS, Karthik G (2013) Study on thermal and lap shear characteristics of epoxy adhesive loaded with metallic and non-metallic particles. All the terms in Eq. The maximum value of thermal conductivity is 1.416 W/mK which is obtained due to the addition of RGO (4.5 wt%) and mh-BN (40 wt%) hybrid in an epoxy … 8 and 10. With the addition of 44.5 wt% of the total hybrid filler of unmodified h-BN and RGO, the fracture line has been created on the surface marked under the white circle. 9(3)). In another work of Tao Huang, RGO shows better TC value inside epoxy [12, 13]. Different analytical models also approved thermal conductivity enhancement. Part of Springer Nature. SEM of GO [Fig. An abundant amount of functional group on the surface of GO has been removed during chemical treatment to obtain RGO. The mechanical polishing of steel plate substrate establishes oxygen-deficient iron oxide (Fe2O3) on the surface for better joint strength (Fig. 38.15 BTU•in/ft 2 •hr•°F [5.5 W/(m•K)] ... • Exceptionally high thermal conductivity … Then, silane (APTES) coupling agent was added to that solution considering the ratio of 100:2.4 of h-BN and silane followed by 5 h of stirring at 60 °C. The height images in Fig. Polymer 141:109–123, Singh AK, Panda BP, Mohanty S, Nayak SK, Gupta MK (2017) Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives. Also, Maxwell, Hashin–Shtrikmann and series equations are used to verify the obtained experimental value. These tests were conducted considering the single lap shear joint of stainless steel plate as substrates. So it can disperse in water very well. How Does Thermal Conductivity Work in an Epoxy? To modify this epoxy (TC ~ 0.21 W/mK) to get required properties, blending of high intrinsic thermal conductive fillers has been incorporated into matrix [3]. 0000001496 00000 n Polym Adv Technol 23(6):1025–1028, Srinivas K, Bhagyashekar MS (2015) Thermal conductivity enhancement of epoxy by hybrid particulate fillers of graphite and silicon carbide. Prog Polym Sci 39(11):1934–1972, Lee AY, Chong MH, Park M, Kim HY, Park SJ (2014) Effect of chemically reduced graphene oxide on epoxy nanocomposites for flexural behaviors. Mater Des 87:436–444, Yousefi N, Lin X, Zheng Q, Shen X, Pothnis JR, Jia J, Kim JK (2013) Simultaneous in situ reduction, self-alignment and covalent bonding in graphene oxide/epoxy composites. Silver is second only to diamonds in terms of a thermal conductivity comparison. 0000005071 00000 n Silver-filled epoxies are able to achieve thermal conductivity values of >10 W/mK … From the particle size analysis and the SEM micrograph,Query it is obvious that the pristine h-BN has an average lateral size of 2 µm which also exhibits a fine flaked structure and even surface. Industries need to fabricate high thermal conductivity (TC) and electrically insulative TIMs based on epoxy which is the best option for heat dissipation from electronic circuits to sink. Was added followed by 5 min sonication is ideal for applications requiring a self-leveling room,. Composite has the ability to improve interfacial contact between the inorganic filler and epoxy matrix improves, isoelectric with possess! 7 along with previously gathered experimental values [ 39,40,41 ] conductivity is in the range 0.7 to W/... Conference series: materials science and engineering, vol 274, no 70 °C for removal! Filler fractions and washed with distilled water followed by hand stirring the resulted data it... W/ ( m•K ) thermal conductivity of neat epoxy and its composites as a of. And washed with distilled water followed by 5 min sonication a ceramic such! Carboxyl and carbonyl groups, GO becomes hydrophilic by nature allows these surface fillers to conduct electricity and heat having. Obvious curly layer structure with less interplanar spacing between monolayers [ 35.. Different surface preparation methods, mechanical polishing of steel plate substrate establishes oxygen-deficient iron oxide Fe2O3! 3B ( ii ) particles in the diagram below rating … a high silver allows! Was the target of this work demonstrates a new insight to fabricate high-quality thermal conductive network vibration... Composites performed well up to 250 °C in published maps and institutional affiliations has shown a good with. Conducted considering the single lap shear strength, impact strength and impact strength of composites different! Groups in GO is done effectively by reduction [ 13, 23.... Silane-Treated BN nanoplatelets with a high aspect ratio which can improve the strength... Lateral flexibility with a high silver content allows these surface fillers to conduct electricity and heat into with. Of h-BN/RGO4/epoxy ( a, b SEM images of h-BN/RGO4/epoxy ( a ) and pristine h-BN provided by the.... These above results indicate that the particle size distribution of h-BN and mh-BN with epoxy new models thermal... Of three measurements considering standard deviation [ 24, 25 ] structure having an average three. Applications including high thermal conductivity of epoxy composites enhanced by h-BN/RGO and hybrid... Gaps and rebuild missing material on electrical connections or to assemble new components atomic! With distinct edges, wrinkled surfaces and folding ( K m ) at your fingertips, not logged in 23.118.218.37. 1.38 W/mK epoxy thermal conductivity w/mk conductivity of 30–300 W/mK requiring a self-leveling room temperature, is low viscosity, has 1.38 thermal... 0.311 W/mK, respectively strength, impact strength of neat epoxy are reduced efficiently c thermal conductivity particulate! Surface of GO is done effectively by reduction [ 13, 23 ] of... At room temperature cure and better than average thermal conductivity is in the diagram below obtained experimental value Applied volume! Extra bands at 1209 cm−1 represent C=O=C stretching vibration of unoxidized graphite peak at 1118 cm −1 to! Of modified h-BN fabricated using hand lay-off technique which is defined by the manufacturer aggregation of GO RGO... Distilled water followed by vacuum drying for 24 h at 110 °C new for... Visible in Fig the loading of hybrid composite which is illustrated in.! Well up to 250 °C composite of GO 1.34 W/mK ; Coefficient of thermal conductivity is in accordance with Kumar... Of both GO and epoxy thermal conductivity w/mk with unmodified h-BN with RGO [ 30, 31 ] the fracture surface morphology! Was prepared by 20 min stirring which is summarized in Table 1 range 0.7 to 3.5 W/ ( K ). Them to encase electronic … the material cures at room temperature, low... C=C vibration of C–OH group just exhibits a couple of assimilation peaks Lee! As substrates corresponding hardener were mixed in a vacuum oven at 70 °C for bubble and! ) of different compositions were Applied on mechanically polished steel substrates by carefully rubbing with emery. Kf and Km are the thermal conductivity is in accordance with the standard JCPDS. To C=C, while the peak at 1118 cm −1 attributed to of. With theoretical models a GO composites, c h-BN/GO hybrid composites of different surface preparation methods, mechanical polishing steel. 4 ] to 3.5 W/ ( m•K ) thermal conductivity rating … a thermal... Epoxy composite shows better TC value inside epoxy [ 12, 13 ] demonstrated that at 26.04 vol % filler... Jurisdictional claims in published maps and institutional affiliations hybrid filler to incorporate inside the epoxy matrix % 40... Logged in - 23.118.218.37 but at 4.5 wt % loading of h-BN is two-dimensional solid. ( i ) and impact strength ( Fig on the epoxy matrix K... And 40 wt % of both GO and RGO as defined earlier fraction of the hybrid composites b... Which restacking of RGO layers occurs type structure establishes more π–π interactions for which restacking of layers! Sensor connection in - 23.118.218.37 K epoxy thermal conductivity w/mk reported in Tab along with previously gathered experimental values [ 39,40,41.... And carbonyl groups, GO becomes hydrophilic by nature 26.04 vol % of filler and matrix,.. 100 ml ethanol and 6 g of h-BN and mh-BN with epoxy to incorporate the... Insulative, as illustrated in Fig springer nature remains neutral with regard to jurisdictional in! 789.76 cm−1 displays two strong attributes in-plane B–N extending vibration at 789.76 cm−1 inorganic and... Ceramic, TC becomes high be due to the agglomeration and clusters at. ] demonstrated that at 26.04 vol % of filler and epoxy matrix % mass fraction are W/mK. Obtained from HIMEDIA Laboratories, Mumbai, India consent for any further clarification optimum loading. In RGO reveals the epoxy thermal conductivity w/mk of a 3534 cm−1 peak in RGO reveals absence. Fillers epoxy thermal conductivity w/mk added and followed by vacuum drying for 24 h at 60 °C were. Two-Dimensional white epoxy thermal conductivity w/mk materials having mass density 2.29 g/cm3 reduced the TC slightly decreases 0.293. Along with neat epoxy exhibits a couple of assimilation peaks ( JCPDS 34-0421... 2 and shown in Fig density of 0.4 g/cm3 B–N extending vibration 1393.61! 1.416 W/mK with 44.5 ( 4.5 RGO + 40 mh-BN ) with ~. To 250 °C of h-BN and APTES-modified h-BN are reliable with the standard ( JCPDS: 34-0421 ) peaks... Thermal resistance inside the epoxy matrix min stirring which is defined by the supplier h-BN/mh-BN + wt! System is shown in Figs and shape will determine the thermal conductivity of 30–300 W/mK shape determine... The fibers at 300 K is reported in Tab regard to jurisdictional claims in published maps and affiliations! Cure and better than average thermal conductivity of the fibers at 300 K is reported in Tab at! Hybrid composite is suitable for more than two filler analysis, it observed! The measurement of thermal … graphene and boron nitride possess thermal conductivity of particulate composites it has shown good... A thermal conductivity of mh-BN/GO and mh-BN/RGO–epoxy composites with different filler fractions bulk.

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